Applied R&D Engineer 5 - IVT at Nokia

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Dallas On-site Full-time Mid Level

Job Details

Status: Active
Category: Engineering
Posted: May 30, 2026
Expires: Aug 28, 2026
Work style: On-site

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About the Role

Overview

High-caliber Principal Engineer to provide technical leadership and operational expertise in semiconductor laser testing and Burn-In (BI) operations.

Role

We are seeking a high-caliber Principal Engineer to provide technical leadership and operational expertise in semiconductor laser testing and Burn-In (BI) operations. Experience with Photonic Integrated Circuits (PICs) is highly advantageous. In this pivotal role, you will oversee die-level optoelectronic testing and BI operations. You will collaborate with multidisciplinary teams to design and execute strategies that ensure high-efficiency, low-cost, and scalable PIC testing in volume manufacturing.

About The Company

Advancing connectivity to secure a brighter world.

Nokia is a global leader in connectivity for the AI era. With expertise across fixed, mobile and transport networks, powered by the innovation of Nokia Bell Labs, we’re advancing connectivity to secure a brighter world.

Learn more about life at Nokia.

Our recruitment process

We act inclusively and respect the uniqueness of people. Our employment decisions are made regardless of race, color, national or ethnic origin, religion, gender, sexual orientation, gender identity or expression, age, marital status, disability, protected veteran status or other characteristics protected by law. We are committed to a culture of inclusion built upon our core value of respect.

If you’re interested in this role but don’t meet every listed requirement, we still encourage you to apply. Unique backgrounds, perspectives, and experiences enrich our teams, and you may be just the right candidate for this or another opportunity.

The length of the recruitment process may vary depending on the specific role's requirements. We strive to ensure a smooth and inclusive experience for all candidates. Discover more about the recruitment process at Nokia.

About The Team

Some of our benefits in US:

Corporate Retirement Savings Plan
Health and dental benefits
Short-term disability, and long-term disability
Life insurance, and AD&D – Company paid 2x base pay
Optional or Supplemental life and AD&D insurance (Employee/Spouse/Child)
Paid time off for holidays and Vacation
Employee Stock Purchase Plan
Tuition Assistance Plan
Adoption assistance
Employee Assistance Program/Work Life Resource Program

The above benefits exclude students.

Disclaimer for US/Canada

Nokia Maintains broad annual base salary ranges for its roles in order to account for variations in knowledge, skills, experience and market conditions, and with consideration to internal peer equity. Check the salary ranges in the job info section for this role.

All North America job posts will post for a minimum of 7 calendar days and up to 180 days or until candidate/s identified.

Responsibilities

Capacity Planning: Own PIC test and BI capacity planning; develop scalable manufacturing strategies for internal facilities and external Contract Manufacturing (CM) partners.
Equipment Development: Support new test and BI equipment design from early phases; champion Design for Manufacturing (DFM) best practices across quality, scalability, maintainability, and cost.
Continuous Improvement: Partner with R&D and Product Integration teams to drive continuous improvement in yields, cycle times, and capital expenditures.
Vendor Management: Develop and manage relationships with equipment vendors and contractors throughout development and capacity ramp cycles.
CM Transfer & Deployment: Lead projects with external CM partners to co-develop and transfer test and BI equipment, overseeing full-scale deployment at CM sites.
Cross-Functional Interface: Act as the primary technical bridge between Nokia Operations, R&D, and CM partners to resolve volume production issues.
Operational Strategy: Define long-term resource strategies to optimize internal operations for demanding production schedules and New Product Introduction (NPI) coverage.

Requirements

Education: Master’s or Ph.D. in Electrical Engineering, Physics, Optical Sciences, or a related discipline.
Industry Experience: 10+ years in high-volume semiconductor laser manufacturing, testing, and reliability.
Technical Expertise: Proven track record in die-level test/BI equipment development and managing equipment contractors.
Global Operations: Demonstrated success transferring and ramping high-volume manufacturing capacity with global CM partners.
Leadership: 5+ years of direct engineering management or technical project leadership experience.

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